产品描述
SX707AH90001#&Semiconductor wafer cluster used in semiconductor chip manufacturing technology (CHIP); 350um(+-)10um thick, SX707AH90001, CSP process, 100% new
交易日期
2024/08/29
提单编号
——
供应商
wisol. co. ltd
采购商
wisol hanoi ltd liability co
出口港
——
进口港
——
供应区
South Korea
采购区
Vietnam
重量
——kg
金额
113.85
HS编码
70200090
产品标签
country apple butter
产品描述
.#&UV shield to reduce adhesion between tape and chip (reusable many times in the factory), made of glass, (MASK T_HG52AS4_PS1M_058056_PLATE_R11_240), size: 126.6mmx126.6mmx2.3mm, 100% new
交易日期
2024/08/29
提单编号
decx1076145
供应商
wisol. co. ltd
采购商
wisol hanoi ltd liability co
产品描述
VQM66CZ30000#&Semiconductor wafer cluster used in semiconductor chip manufacturing technology (CHIP); 350um(+-)10um thick, VQM66CZ30000, CSP process, 100% new
交易日期
2024/08/29
提单编号
——
供应商
wisol. co. ltd
采购商
wisol hanoi ltd liability co
出口港
——
进口港
——
供应区
South Korea
采购区
Vietnam
重量
——kg
金额
113.85
HS编码
70200090
产品标签
country apple butter
产品描述
.#&UV shield to reduce adhesion between tape and chip (reusable many times in the factory), made of glass, (MASK T_HG52AS4_PS1M_058056_ROOF_R11_2408), size: 126.6mmx126.6mmx2.3mm, 100% new
交易日期
2024/08/29
提单编号
decx1076145
供应商
wisol. co. ltd
采购商
wisol hanoi ltd liability co